Customization: | Available |
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Application: | Aerospace, Construction Industry, Electronic device, Film for Capacitor Use |
Material: | Polyethylene |
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Properties | Unit | Typical value |
Density | g/cm3 | 0.905±0.005 |
Thickness | µm | 2.0µm-12µm |
Tensile Strength | MD(MPa) | ≥100 |
Elongation at Break | MD(%) | 20~200 |
Elastic Modulus | MD(MPa) | 2800 |
Heat Shrinkage | MD(%) | ≤5 ( 120ºC, 10min) |
Wetting Tension | mN/m | 38(Corona treated side) |
Surface Roughness | µm | 0.08 |
Melting Point | ºC | 172 |
Volume Resistivity | Ω.m | >1015 |
Break-dowm Voltage | V/µm | ≥350(23ºC,DC) |
Dielectric Constant | 2.2 (20ºC,1KHz) | |
Dissipation Factor | ≤4×10-4 (20ºC,1KHz) | |
RC | Ω F | ≥5×104 |
Properties | Unit | Typical value |
Density | g/cm3 | 1.4 |
Thickness | µm | 1.9µm-12µm |
Tensile Strength | MD(MPa) | ≥84 ≥108 ≥120 |
Elongation at Break | MD(%) | ≥22 ≥33 ≥44 |
Elastic modulus | MD(MPa) | 3500 |
Break-dowm voltage | V/µm | >=200 >=250 (23ºC,DC) (23ºC,DC) |
Heat Shrinkage | MD(%) | ≤2.5(150ºC, 10min) |
Surface roughness | µm | 0.095 |
Melting point | ºC | 256 |
Volume resistivity | Ω.m | >1015 |
Dielectric constant | 3.2 | |
Dissipation Factor | ≤60×10-4 | |
RC | Ω F | ≥1×104 |